<New Graduate Hiring> Marking Process Engineer
Posted Updated 5
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Summary
Process engineer maintaining and improving semiconductor assembly processes like molding and laser marking, with a focus on yield improvement and new technology development.
Responsibilities:
•Process engineer include Molding and Laser Marking process. Well-known Assembly front-end & back-end process is preferred.
•Focus on process maintenance and improvement, new technology development, and continues yield improvement.
•Collaboration with related departments including internal or external.
Qualifications:
•Bachelor or Master's degree, major in Mechanical or Material Engineering or other related disciplines
•Seniority less than 2 years.
•Ability to speak and write in English fluently.
•Good communication (Chinese and English) and emotion management..
•Learning, innovation, fast-paced, and teamwork.
More information about NXP in Greater China...