<New Graduate Hiring> Marking Process Engineer

Summary

Process engineer maintaining and improving semiconductor assembly processes like molding and laser marking, with a focus on yield improvement and new technology development.

Responsibilities:

Process engineer include Molding and Laser Marking process. Well-known Assembly front-end & back-end process is preferred.
Focus on process maintenance and improvement, new technology development, and continues yield improvement.
Collaboration with related departments including internal or external.

Qualifications:

Bachelor or Master's degree, major in Mechanical or Material Engineering or other related disciplines
Seniority less than 2 years.
Ability to speak and write in English fluently.
Good communication (Chinese and English) and emotion management..
Learning, innovation, fast-paced, and teamwork.


More information about NXP in Greater China...

#LI-2370