New Product Introduction Engineer
Summary
Develops and improves end-of-line processes for power module packaging, including transfer molding, using statistical tools and DFMEA/PFMEA methodologies.
End of Line process development and enabling technology for transfer molded power module.
o Capable to understand power module design and proposal for improvement from End of Line process.
o Familiar with DFMEA, update DFMEA and generate PFMEA linked with DFMEA.
o Familiar with EMC materials.
o Capability to define KPIV from failures modes.
o Capability to define KPOV and generate output by analyzing process capability.
o Responsible for providing technical report from FMEA failures mode based on statistical analysis (JMP, Minitab).
o Effectively working with technical leaders to generate process deliverables (Control Plan, D/PMEA, etc.).
· Technical Leadership on End of Line Process.
o Capable to initiate new process and equipment working with technical leader and supplier.
o Responsible for P.O spec generation and buy-off.
o Capable to create COO for new process and equipment.
o Capable for benchmarking on the new and better process/equipment which do not exist in company.
o Capability to create End of Line process technology roadmap, especially for molding.
o Capability to generate new design rule based on characterization, working with technical leader and designer.
o Capable to understand customer requirements, application and EHS.
o Capable to find systematic solution and improvement planning for process defects.
o Supporting quality issue during production, effectively working with manufacturing team.
· COE Line Equipment Maintenance and Management.
o Capable for Mold, Trim/Form equipment and tooling Set-up (on-hand skills).
o Responsible for tooling and jig design, working with designer and suppliers for new tooling/jig design.
o Responsible for equipment/tooling/jig readiness on time.
o Leading End of Line technician/operators to do the right job.
o Sharing
· 5+ years in package development.
· Experienced areas: Power module package (transfer molded, gel filled) development, DSC experience is an advantage.
· Experienced packages: Transfer molded power module (Intelligent Power Module, Dual Side Cooling Module, Power Discrete) is an advantage.
· Degree or Master in any Engineering fields.
· Familiar with statistical SW (JMP, Minitab), Auto-CAD and MS-office (PowerPoint presentation).
· Personal characteristics: Self-motivated, independent, open mind to communicate, willing to take risk and ability to manage people and task.