Package Architect
Summary
Defines and drives semiconductor package architecture, balancing electrical, thermal, and cost constraints while collaborating with silicon and hardware teams to ensure production-ready designs.
Job Details:
Job Description:
Translates product requirements into package architecture specification, drives end-to-end package solutions for physical, electrical, and cost requirements. Leads technology trade-off decisions ensuring silicon packages conform to electrical, mechanical, thermal, and reliability standards, specifications, and landing zones.
Collaborates with silicon, hardware, and package leads to ensure high quality package output and aids in removing roadblocks.
Oversees end-to-end package development process, including design, processes, and procedures and continuously improves packaging quality standards and targets.
Applies expertise in package design troubleshooting, resolves new and existing packaging problems involving designs, materials, and processes and provides innovative and cost-effective solutions.
Collaborates with manufacturing team to ensure the packaging design and tape-out seamlessly transition to production.
Qualifications:
What We Want to See
We are seeking someone with 15+ years of experience and a BS/MS in EE, ME, CE, CS or related fields with experience in one or more of the following:
- Packaging or Board design development and equivalent package design tools
- Lead substrate and package design and development projects
Ways to Stand Out from the Crowd
- Experience in developing & automated design flows and tracking design efficiency metrics
- Experience in Semiconductor Packaging Substrate technology design and development
- Experience in Package design tools such as Mentor Graphics, Cadence and/or Auto CAD