Package Process Development - Sr. Manager, Engineering

Description

We are seeking an experienced and highly motivated Senior Manager, Package Process Development to lead the development and industrialization of advanced RF System-in-Package (SiP) technologies. This role will be responsible for driving package process innovation, leading New Technology Introduction (NTI) activities, and establishing robust manufacturing processes that enable high-volume production of next-generation RF modules and SiP products.The ideal candidate possesses deep expertise in RF SiP packaging technologies, assembly processes, process characterization, reliability requirements, and manufacturing scale-up. This individual will collaborate closely with product design, package design, technology development, suppliers, and manufacturing teams to accelerate technology readiness and product commercialization.

Key Responsibilities

Technology Development & NTI

• Lead New Technology Introduction (NTI) activities for advanced RF SiP packaging platforms.
• Develop process roadmaps and technology strategies to support future RF module and SiP product requirements.
• Evaluate and introduce innovative assembly, interconnect, molding, substrate, shielding, and packaging technologies.
• Drive Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Reliability (DFR) initiatives during product development.
• Partner with cross-functional teams to ensure seamless transition from technology development into production.

Package Process Development

• Own development and optimization of RF SiP assembly processes, including:
  • Die Attach
  • Flip Chip Assembly
  • Wire Bonding
  • Wafer-Level Packaging Integration
  • Underfill
  • Encapsulation/Molding
  • Shielding Processes
  • SMT and Board-Level Assembly
• Define process windows, critical process parameters, and control methodologies.
• Lead DOE (Design of Experiments), process characterization, root cause analysis, and yield improvement initiatives.
• Establish process specifications, qualification plans, and manufacturing standards.

Manufacturing Readiness & Production Transfer

• Drive process development activities from concept through production release.
• Lead pilot builds, engineering builds, process qualification, and production ramp readiness assessments.
• Develop process control plans and monitoring strategies to ensure consistent manufacturing performance.
• Work closely with OSATs, subcontractors, equipment vendors, and manufacturing partners to implement scalable production solutions.
• Support factory transfer and production ramp-up activities.

Reliability & Quality

• Partner with reliability and quality engineering teams to ensure package/process robustness.
• Define package qualification requirements and reliability stress test plans.
• Lead failure analysis investigations and corrective action implementation.
• Ensure compliance with customer, industry, and regulatory reliability requirements.

Leadership & Team Development

• Build and lead a high-performing package process development team.
• Provide technical mentorship and career development for engineers.
• Foster a culture of innovation, accountability, and continuous improvement.
• Coordinate activities across global engineering, manufacturing, and supplier organizations.

Required Qualifications

• MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.
• 12+ years of semiconductor packaging experience with at least 3 years in a technical leadership or management role.
• Strong hands-on experience in RF SiP package development and assembly process engineering.
• Proven track record of successfully launching new package technologies into mass production.
• Deep understanding of semiconductor package assembly processes and equipment.
• Experience with NTI programs and technology transfer to manufacturing.
• Strong knowledge of statistical process control, DOE, FMEA, SPC, and process qualification methodologies.
• Experience working with OSATs and external manufacturing partners.
• Excellent problem-solving, communication, and cross-functional leadership skills.

Desired Experience and Skills

• Extensive experience with RF front-end modules, wireless communication products, or advanced SiP technologies.
• Knowledge of RF performance impacts associated with package structures and assembly processes.
• Experience with advanced packaging technologies such as:
  • Fan-Out Packaging
  • Wafer-Level Packaging (WLP)
  • Panel-Level Packaging (PLP)
  • Heterogeneous Integration
  • Multi-Chip Modules (MCM)
  • Embedded Component Technologies
• Strong understanding of package reliability physics and failure mechanisms.
• Experience supporting automotive, mobile, Wi-Fi, Bluetooth, GNSS, or cellular RF products.

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