Package technology Reliability senior engineer/Technical manager I

1. New Product risk assessment and assembly chip level & board level reliability qualification plan
2. Qualification failure electrical & physical analysis
3. New product reliability concern engagement with customer
4. New assembly supplier audit & qualification
5. Assembly supplier quality & reliability management (Quality incident handling, PCN, regular audit, score card, etc.)
6. New product/technology introduction quality & reliability management
7. Assembly supplier quality improvement project

#LI-JK1

1. MS degree (or above) in Science or Engineering.
2.Familiar with Assembly or substrate processes. (FCCSP/WLCSP/Wire bond/InFO/CoWoS)
3. Familiar with problem solving and 8D CAR methodology
4. VQA/IQA or MQR related experience
5. Package IC & Board level reliability qualification experience