Package technology Reliability senior engineer/Technical manager II

1. New Product risk assessment and assembly chip level & board level reliability qualification plan
2. Qualification failure electrical & physical analysis
3. New product reliability concern engagement with customer
4. New assembly supplier audit & qualification
5. Assembly supplier quality & reliability management
6. New product/technology introduction quality & reliability management
7. Assembly supplier quality improvement project

#LI-JK1

1. MS degree (or above) in Science or Engineering.
2. Familiar with 3D advanced package (ex: SOIC) or Silicon Photonic (CPO) assembly technology
3. Familiar with problem solving and 8D CAR methodology
4. MQR related experience
5. Package IC & Board level reliability qualification experience