PCB Design Engineer

Job Description

Role Purpose
The purpose of this role is to perform the development of VLSI system by defining the various functionalities, architecture, layout and implementation for a client

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• Review and contribute to schematics — understand circuit intent across power/precision supplies, ATE instrument (SMU / FVMI / FIMV) interfaces, high-speed MIPI, and control.
• Translate EE requirements into PCB design strategy — stackup, controlled impedance, PDN/decoupling, layer and reference-plane assignment, return-path planning, length/skew matching.
• Design for test scale-up — architect load boards, interface/slot boards, and pallets that scale from bring-up to high-volume manufacturing (dozens → hundreds of parallel sites) with correctness and reproducibility at scale.
• Own system-level SI & PI — impedance, PDN target-Z and anti-resonance, return-path integrity, and remote/Kelvin-sense loop stability across the full path (tester → cable → interface/slot board → pallet → socket → DUT), not just a single board. Includes IR-drop/PDN budgets, decoupling, crosstalk, and C-PHY/D-PHY routing.
• Drive suppliers and OSATs — author and own PCB constraints and layout direction; drive layout designers, PCB fab/CM suppliers, and OSAT/test houses to execute correctly; critically review their work and catch incomplete or wrong supplier "fixes."
• Design for deployment — ensure hardware is buildable, reproducible, and deployable across sites and geographies for HVM; drive DFM/DFA/DFT and material / REL-qual selection (thermal cycle, MSL, via reliability).
• Own end-to-end through HVM release — carry the design past layout handoff through bring-up, debug, bench correlation, and volume release; partner with ME on sockets, fixtures, mechanical integration, and EE↔ME tolerance stacks.
• Collaborate cross-functionally — with test, ME, silicon, and TPM; share design decisions transparently and participate in peer design reviews.

Work arrangement: primarily remote / work-from-home, with the ability to be on-site at the Asia lab (co-located with the OSAT / fab, e.g., Taiwan) during prototype bring-up and debug phases — hands-on lab work (scope, rework, characterization) happens on-site in Asia.

Travel: approximately 10% travel to OSAT / fab / test sites as needed

Language: Bilingual English – working proficiency ( communicate with customer & cross functional teams in US) & Mandarin

Skills

Must Have Skills:

• Proven schematic capture and review ability with solid analog/digital/power fundamentals, and the ability to translate EE requirements into a PCB design strategy. (Candence OrCAD / HDL , Allegro)
• Test / ATE hardware design — multi-site load boards, interface/slot boards, probe/socket interfaces. (Semiconductor test hardware is materially different from consumer PCB design.)
• PCB design in a professional EDA tool (Cadence Allegro / Constraint Manager or equivalent): stackup, controlled impedance, PDN, and system-level SI/PI.
• Strong working understanding of test scale-up (multi-site) and OSAT/deployability across the tester-to-DUT path.
• Demonstrated track record driving PCB fab / CM / assembly suppliers to correct execution.
• Exceptional cross-functional communication — tactfully push back on incomplete requirements or schematics, negotiate trade-offs with EE and ME, explain trade-offs clearly to non-PCB stakeholders, and firmly hold suppliers accountable (no DRC hacks).
• Hands-on in the lab — probes, reworks, and characterizes boards; proficient with high-speed oscilloscopes, DMMs, and power supplies, and comfortable with PCB rework/soldering for immediate prototype debug.
• Disciplined BOM and release management — respects PLM / version-control and issue-tracking processes (e.g., Agile / Arena / Teamcenter, Jira / Confluence, or equivalent).

Preferred Skills:

• Deep, independent ownership of cross-board, system-level scale-up strategy — sets design standards, resolves the hardest SI/PI, scale-up, and REL trade-offs.
• Proven OSAT engagement and HVM test-hardware deployment across sites/geographies at scale.
• Advanced SI/PI — PDN anti-resonance, return-path discontinuities, remote-sense loop stability — with tools (Sigrity / HFSS / TDR / VNA).
• High-speed serial (MIPI C-PHY / D-PHY), high-current / precision supply design.
• REL/qual and semiconductor test-flow (CP / FT) familiarity.