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英屬開曼群島商世芯股份有限公司台灣分公司

Physical Design Manager

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Description

1. Responsible for the digital back-end physical implementation from netlist to GDS, completing the chip sign-off process.
2. Complete the full-chip floorplanning, including chip partitioning, power and ground network, placement of critical modules, utilization optimization, pin assignment.
3. Complete the overall digital back-end design of the chip, including placement, clock tree implementation, timing closure, power calculation, IR drop analysis, SI closure, and physical verification.
4. Co-work with front-end design team for the logic, clock and timing optimization.
5. Co-work with package team for the substrate design and SIPI simulations.

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