Plating Process Engineer(196135)

Your Job

Molex is seeking an experienced Plating Process Engineer to support FPC and PCB manufacturing processes, including copper plating, gold plating, ENIG, and other electroplating and surface treatment operations at the Sanchong plant.

This hands-on process engineering role is responsible for improving plating thickness stability, uniformity, adhesion, appearance quality, reliability, yield, and overall process capability. The successful candidate will use production data, process knowledge, customer requirements, and engineering standards to support new product introduction, validation of new materials, chemicals, equipment, and processes, production troubleshooting, and continuous improvement.

Our Team

Manufacturing Engineering / Process Engineering Team

The team partners with Production, Equipment Engineering, Quality, Product Development, R&D, and suppliers to sustain capable plating processes and deliver reliable FPC connector products.

What You Will Do

• Develop, optimize, control, and sustain FPC and PCB plating processes, including copper plating, gold plating, ENIG, and other applicable surface treatment processes.

• Establish and monitor critical process parameters and control limits for bath chemistry, plating thickness, uniformity, adhesion, appearance, and reliability.

• Analyze plating defects and process excursions, determine root causes, and implement effective corrective and preventive actions to improve yield and process stability.

• Support the introduction, trial, qualification, and production implementation of new products, materials, plating chemicals, equipment, and processes.

• Plan and execute engineering experiments and process validations using production data, DOE, SPC, and process capability analysis.

• Partner with Production and Equipment Engineering to improve line stability, equipment effectiveness, throughput, and manufacturing continuity.

• Work with Quality, Product Development, R&D, laboratories, and suppliers to resolve technical issues and meet product and customer requirements.

• Manage plating bath conditions through analytical results, replenishment controls, contamination prevention, and chemical life-cycle monitoring.

• Drive improvement projects focused on yield, quality, cycle time, material consumption, cost, and process capability.

• Create and maintain process specifications, work instructions, PFMEA, Control Plans, trial reports, validation reports, abnormality analyses, improvement reports, and technical records.

• Ensure all process activities comply with applicable safety, environmental, chemical handling, and waste management requirements.

Who You Are (Basic Qualifications)

• Associate degree or above in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, Mechanical Engineering, or a related technical discipline.

• At least 7 years of experience in FPC, PCB, electroplating, surface treatment, or related process engineering.

• Hands-on experience with copper plating, gold plating, ENIG, or other electroplating and surface treatment processes.

• Knowledge of plating bath management and critical controls for thickness, uniformity, adhesion, appearance, and reliability.

• Ability to analyze production data and process conditions, identify root causes, and implement sustainable improvements.

• Experience applying SPC, DOE, 8D, 5 Why, PFMEA, and Cp/Cpk in process control and problem solving.

• Ability to work effectively across functions and communicate technical findings clearly.

• Proficiency with standard computer applications for data analysis, reporting, documentation, and record maintenance.