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NXP Semiconductors

Open 16d

Plating Process Engineer

Posted Updated
Discussion

Responsibilities

  • Provide process support for Electroplating processes

  • Drive Continual process improvement activities to improve the productivity and capacity

  • Work closely with maintenance and equipment engineering to trouble shoot issues, develop maintenance plans, recommend tooling upgrades etc.

  • Generate and maintain process documentation

  • Provide technical support and training to production personnel

  • Lead the New Developments/Projects, liaise with vendors on the new products and tooling developments

  • Design and fabricate new tooling for the existing/new products

  • Troubleshooting / maintaining the plating line

  • Assist in Implementation of action plan to reduce production scrap and quality issues

  • Engage in process and productivity improvement

  • Organize working groups to solve Quality problems / Continuous improvement when necessary

  • Ensure that corrective and preventive actions are carried out as per the plan

  • Monitor process stability and process capability values

  • Provide the weekly or monthly reports to management

  • Support maintenance team to run the Waste water treatment plant operations

  • Track and improve team performance

  • Other duties as assigned by Management

Requirements

•Candidate must possess a Bachelor's Degree in Engineering (Chemical / Mechanical) or equivalent

•2 to 3 years of related working experience. Fresh graduates are encouraged to apply.

•Candidate must be comfortable to work in a chemical environment


More information about NXP in Malaysia...

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Skills

See also

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