PQE / Process Quality Engineer (SMT PCBA Focus)

Key Responsibilities

1. In‑Process Quality Monitoring & Daily Defect Handling

Carry out SMT on‑site process quality patrol for printing, placement, reflow, SPI, AOI, ICT and post‑reflow visual inspection stations. Track real‑time defect data including bridging, tombstoning, BGA void, open solder, component offset, solder ball etc.
Handle on‑line quality abnormalities; organize on‑site cross‑functional root‑cause investigation for sudden yield drop and mass defect events. Initiate containment actions such as line hold, product segregation, 100% screening to stop non‑conforming product flowing to downstream process.
Participate in MRB review for in‑process non‑conforming PCBA, provide defect evidence and quality suggestion for disposition decision (scrap, rework, concession, sort).

2. Quality Data Analysis & Continuous Improvement

Monitor core SMT quality KPIs: First‑Pass Yield (FPY), in‑process defect PPM, AOI false alarm/escape rate, rework rate, test failure rate.
Analyze defect Pareto chart and trend chart, distinguish defects induced by material, process parameter, equipment, operation or environment. Lead or join quality improvement projects, apply QC seven tools, SPC, FMEA, 8D to drive corrective and preventive actions implementation.
Verify improvement effectiveness, track closure status of quality countermeasures, avoid defect recurrence.

3. Process Quality System & Standard Management

Participate in review of PFMEA, Control Plan, SOP for SMT process; check production execution compliance against control plan and work instruction.
Review AOI/SPI program quality risk; support golden sample, defect‑sample library maintenance for SMT PCBA assembly defects.
Support internal quality audit and customer on‑site audit; prepare in‑process quality records, defect evidence and KPI data for audit.

4. On‑site Training & NPI Quality Support

Support NPI new product trial run, attend SMT NPI build‑up, identify in‑process quality risks during prototype and pilot stage, feedback risks to DFM/process engineer before mass production.
Train production operators, inspectors and technicians on SMT assembly defect recognition, acceptance criteria per IPC‑A‑610, and non‑conformance reporting procedure.