Principal Manufacturing Engineer – Subcon, Backend, Assembly
Summary
Oversee semiconductor assembly and backend production at external subcontractor sites, ensuring quality, yield, and compliance while driving cost reductions and new product introductions.
Responsibilities
- Act as technical interface between Nexperia and external subcontractor manufacturing sites (assembly / backend production)
- Review and approve process or material changes introduced by subcontractors (first-level technical gatekeeper)
- Support process risk assessments and ensure manufacturing changes meet quality and reliability requirements
- Drive resolution of production issues, yield problems, and quality deviations at subcontractor sites
- Monitor and manage subcontractor performance, including operational and quality KPIs
- Support NPI (New Product Introduction) and industrialization of new packages/processes at subcontractors
- Lead or support cost reduction and value engineering initiatives
- Participate in audits (customer, quality, VDA) and support compliance verification activities
- Support project milestones, technical reviews, and subcontractor performance reporting
Requirements
- Bachelor’s degree in Electrical, Electronics, Mechanical Engineering, or related field
- 10+ years of experience in semiconductor assembly / wafer level / backend manufacturing
- Strong experience in high-volume and high-mix production environments
- Good understanding of semiconductor packaging processes and manufacturing flows
- Project management experience in engineering or manufacturing environments
- Strong analytical and problem-solving skills
Certifications & Qualifications
- Bachelor’s degree in Electrical Engineering
- Bachelor’s degree in Electronics Engineering
- Bachelor’s degree in Mechanical Engineering