Principal New Product Introduction Engineering Manager (Spark)

• Crusoe is a vertically integrated AI Factory accelerating energy and compute infrastructure. We are seeking a New Product Introduction (NPI) Engineering Leader in the Spark Business Unit to bridge Spark Hardware Design with enterprise execution
• In this role, “hardware” and “product” refers to the physical infrastructure of the Spark module: structural steel modules, RPPs, DLC cooling loops, CDUs, chillers, piping headers, electrical and mechanical systems, and power distribution gear. Compute hardware (servers, GPUs, storage, networking, and rack specifications) is owned by Cloud Product
• Sitting on the Spark Hardware product team, you are the single-threaded owner ensuring the physical module is fully verified for handoff to manufacturing. You gather and lead everything needed to introduce Spark hardware modules into the Crusoe ecosystem, orchestrating the NPI phase-gate process to turn the design team’s output into one complete NPI packet
• You don’t run manufacturing. You equip and support Manufacturing and Supply Chain with clean design baselines, complete documentation, and qualified inputs to build at scale
• Framework Ownership: Own the Spark hardware NPI framework (Concept to Launch) within the Spark BU to align design engineering progress with enterprise release readiness
• Release Authority: Define design release readiness for physical Spark modules. Ensure design freeze and production gates clear only when product specs, subsystem verification tests, and manufacturing handoff criteria are fully met
• Design Package Quality: Enforce gate discipline to resolve design, thermal interface, and electrical interference issues in engineering well before drawings and BOMs reach manufacturing, such that manufacturing receives a clean and complete NPI packet
• Product Readiness Scorecard: Maintain an objective hardware readiness scorecard (modeled on MRL/PRR standards) providing clear product maturity visibility to leadership and manufacturing
• Design Baseline & Change Control: Manage engineering baseline transitions into production. Support ECO/ECN workflows in PLM so Supply Chain and Manufacturing operate against clear, unambiguous release states
• Handoff Package Completeness: Deliver complete hardware release packages to downstream teams, including CAD models, structural drawings, electrical single-lines, fluid schematics, multi-level BOMs, and factory acceptance test (FAT) criteria
• Cross-Functional Alignment: Translate Spark hardware roadmaps into actionable handoff schedules for Supply Chain, Quality, Manufacturing, and Construction well ahead of production builds
• Validation Campaigns: Plan and orchestrate first-of-a-kind (FOAK) prototype builds. Participate on the shop floor during validation runs to feed design-for-manufacturability (DFM) insights back to engineering
• Manufacturing Enablement: Partner directly with Manufacturing, ensuring their engineering team has the documentation, assembly instructions, tooling access, and test specs for a smooth line setup
• Supply Chain Synchronization: Partner with Supply Chain early to identify long-lead electrical and thermal components, ensuring supplier vetting before design freeze
• Subsystem Hardware Integration: Ensure core physical elements (mechanical shells, structural frames, Direct-to-Chip cooling loops, 800V DC distribution, and rack interfaces) are validated as a cohesive package prior to release
• Downstream Deployment Handoff: Ensure released packages include clear interface control documents (ICDs) usable by site engineering, civil construction, and commissioning teams
• Ramp Support: Partner closely with Manufacturing during initial production ramps to resolve design friction or supply exceptions and protect schedules
• Single Source of Truth: Provide executive stakeholders and Spark BU leadership unified visibility into release readiness, subsystem risks, and manufacturing enablement
• Closed-Loop Feedback: Lead post-launch reviews following build campaigns to capture field and factory feedback, continually refining release standards for future hardware generations

Benefits

• Health & wellbeing: Comprehensive health benefits designed to support your overall wellness
• Time away: Paid time off for vacations, family bonding, and unexpected needs
• 401(k) match: Build your financial future with our 401(k) matching program
• Mental wellness: Resources and support for your emotional wellbeing and navigating life’s challenges

• Required: Bachelor’s degree in Mechanical, Electrical, Industrial, or Systems Engineering, or a related physical engineering discipline
• Proven track record equipping manufacturing, supply chain, and field teams with high-quality release packages
• 10 to 15 years in hardware NPI, technical program management, or systems engineering within a physical hardware organization
• Direct experience holding release authority and guiding complex hardware programs from concept through transfer-to-manufacturing
• Fluent in Level of Development (LOD) frameworks (i.e. LOD 100–400)
• Quality & Validation: FMEA, First Article Inspection (FAI), hydrostatic leak testing, and electrical high-pot testing standards
• NPI & Handoff Methodology: Mastery of phase-gate frameworks, hardware verification, and formal transfer-to-manufacturing processes
• Design for Excellence (DFX): Practical knowledge of DFM, DFA, and DFT principles to optimize design packages for assembly and testing prior to release
• PLM & Configuration Management: Expertise in PLM systems, multi-level hardware BOMs, revision control, and structured ECO/ECN workflows
• Experience with modular, containerized, or prefabricated infrastructure product lines
• Familiarity with high-density data center physical requirements (fluid manifolds, heat exchangers, heavy electrical equipment)
• A collaborative approach combining rigorous design package standards with a commitment to cross-functional empowerment