Principal Packaging Engineer: Data-Driven Integration

1100 Micron SemiAsiaOP Pte Ltd is seeking an engineer to develop and enable advanced package technology for post-fab wafer finish and assembly processes. You will drive yield improvements, reduce costs, and collaborate with process and product engineering teams to integrate semiconductors.

The role requires strong data analytics skills (Python/R/SQL), experience with SPC/DOE, and familiarity with E3/FDC/RMS for equipment and process control. A PhD is welcomed but not required.