Principal Process Development Engineer-InP photonic integrated circuits (PICs)

Job Family Description

We are seeking a highly motivated and technically skilled engineer to join the team bringing-up and qualifying a new Indium Phosphide (InP) photonics semiconductor fabrication facility. As a Process Development Engineer, you will be a senior individual contributor within Nokia’s Optical Components organization, participating in the development, optimization, and transfer of key process technologies that will enable advanced high-volume manufacturing of InP photonic integrated circuits (PICs).

This role requires technical expertise across semiconductor wafer fabrication methods and related device processing technologies, working closely with fellow engineers and internal stake-holders to enable efficient, high-yield integration of manufacturing processes.

Responsibilities may include:

Process Development & Integration: Developing and optimizing wafer fab process modules (etch, deposition, lithography, metallization, etc.) for InP-based PICs and lasers, ensuring process robustness and repeatability. Developing fabrication process flows based on design requirements, tool capabilities, and manufacturing constraints. Contribute to continuous improvement of tools, methods, and best practices.

Manufacturing Data & Yield Excellence: Analyzing and interpreting data from device and process metrology collected in a manufacturing environment. Applying SPC, process capability analysis (Cp/Cpk), and statistical methods to evaluate and improve process performance.

Technical Leadership:

Collaborating with device design, product engineering, and reliability teams to support technology readiness and product ramp.

Acting as a technical interface with external or remote fabrication facilities and potential equipment vendors, ensuring alignment on process requirements and priorities.

Leading and contributing to FMEA activities, root cause analysis, and corrective actions for yield and reliability issues.

• BS/MS or PhD (preferred) in Electrical Engineering, Materials Science, or related field. Minimum of 3 years of experience developing and manufacturing compound semiconductor materials, devices and processes.
• Process design and development for compound semiconductor devices based on III-V materials is highly desirable.
• Metal, semiconductor, and dielectric deposition and etching tools, chemistries, and methods.
• FMEA, SPC, process capability, and metrology.
• Excellent communication and teamwork skills; able to work in a fast-paced startup or ramp-up environment.