Process Engineer - Back Grind & Saw
Description
About us
STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.
About the role
Support qualification & engineering builds for pre-assembly and customer builds from engineering to high volume production. All aspects of this job are NPI and Qual Engineering plant wide, affecting operations.
Key responsibilities
Coordinates with Operations to ensure that Engineering Builds are processed per requirement.
Perform customer evaluations and DOE & provide recommendation for improvements if necessary.
Ensures smooth transition of new products from Engineering Mode to High Volume Manufacturing.
Provide corrective actions & improvement plans for all issues observed during Engineering & Qualification builds.
What we're looking for
In-depth knowledge of Backgrind, Laser Groove & Wafer Saw process.
Preferably 3 years experience in Pre-Assembly process.
Good knowledge in SPC & Problem Solving Methodology.
Good communication skills.
Able to work beyond normal working hours if needed.