Process Engineer (CMP / Technology Development)

Responsibilities

• Develop and optimize wafer thinning processes, including grinding and CMP, for Chip-to-Wafer applications, including associated metrology processes.
• Establish and maintain process specifications, design and execute experiments, analyze process data, and troubleshoot process integration and yield-related issues.
• Partner with cross-functional teams to enhance process performance, reliability, manufacturability, and production readiness.
• Lead process improvement initiatives and support technology transfer activities to ensure robust and stable manufacturing processes.

Requirements

• Bachelor's Degree in Electronic, Electrical, Chemical, Mechanical Engineering, Materials Science, Physics or related field.
• Experience in semiconductor foundry module process development or manufacturing.
• Familiarity with semiconductor process and quality methodologies, including SPC, 8D, DOE,FMEA, and PMO
• Strong knowledge and practical experience in process development, optimization, characterization, and troubleshooting.
• Experience with advanced technology nodes, particularly 22/28 nm will be an advantage.
• Strong knowledge and practical experience in process development, optimization, characterization, and troubleshooting.
• Demonstrated leadership capability in driving cross-functional teams and managing projects involving process improvement and technology transfer.

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Nguyen Thi Doan | R23116355

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