Process Engineer - Fremont
Summary
Process Engineer in semiconductor manufacturing develops and optimizes die and wire bonding processes, troubleshoots production issues, and supports equipment qualification in a cleanroom environment.
Primary Duties & Responsibilities
Process Development & Optimization
- Develop, optimize, and deploy die bonding and wire bonding processes resulting to high reliability
- Establish process parameters for die attach specific for eutectic die bonding and wire bonding applications
- Improve assembly yield, reliability, cycle time, and product performance through in depth data-driven analysis
- Support product development activities from prototype builds through production release
Manufacturing Support
- Provide day-to-day engineering support to production operations
- Troubleshoot process issues related to die placement accuracy, bond integrity, wire pull strength, etc
- Monitor process capability and implement corrective/preventive actions
- Collaborate with operators, technicians, and quality teams to resolve manufacturing challenges
Equipment & Qualification
- Support equipment qualification, calibration, and maintenance of die bonders and wire bonders and other assembly related equipment
- Create and maintain machine programs, recipes, and tooling documentation
- Conduct process validation activities including DOE, GR&R, and capability studies
Documentation & Continuous Improvement
- Prepare work instructions, process flows, process FMEA, control plans, and engineering reports
- Lead continuous improvement projects focused on yield enhancement and cost reduction
- Participate in LEAN manufacturing initiatives
Education & Experience
- At least a bachelor’s degree in Electronics or Electrical engineering or related discipline or courses with at least 3 years of relevant work experience in Semiconductor or Electronics / Opto-electronics and Fiber Optics Industry. Experience on start-up manufacturing and related New Product Introduction activities such product development, process characterization, debug and design reviews, is a plus. Recent college graduate maybe considered thus application is encouraged.
Skills
Technical :
- Knowledgeable of eutectic die bonding, gold wire ball bonding techniques, package reliability techniques and equipment
- Experienced on SPC, DOE, FMEA, and industry known root cause analyses
- Able to interpret engineering drawings and process documentations
- Knowledgeable of reliability standards for optoelectronic devices is preferred
Competency:
- Possess strong analytical and problem-solving skills
- Pay attention to details and precision
- Has excellent communication and teamwork abilities
- Able to work in a fast-paced manufacturing environment
- Has mindset of continuous improvement and can work with ambiguity
Working Conditions
- This role is 100% onsite in either the cleanroom or office settings.
Culture Commitment
Ensure adherence to company’s values (ICARE) in all aspects of your position at Coherent Corp.:
Integrity – Create an Environment of Trust
Collaboration – Innovate Through the Sharing of Ideas
Accountability – Own the Process and the Outcome
Respect – Recognize the Value in Everyone
Enthusiasm – Find a Sense of Purpose in Work