Process Engineer - Semiconductor Equipment

Unlike a typical wafer fab Process Engineer role, this position focuses on advanced semiconductor equipment and process development. You will work on developing and optimizing hybrid bonding processes on client’s cutting-edge equipment platforms, conducting process experiments, improving yield, defining new process flows, and supporting customer process development. It is an excellent opportunity to move beyond production sustaining into equipment technology, application engineering, and next-generation advanced packaging.

Key Responsibilities:

• Develop and optimize D2W hybrid bonding processes to improve yield and process capability.
• Plan and execute DOE, process experiments, and data analysis.
• Define new process flows and evaluate customer feasibility.
• Optimize hybrid bonding and annealing processes.
• Prepare SOPs, technical documentation, and Best Known Methods (BKM).
• Support machine setup, customer demonstrations, and application development.
• Troubleshoot process-related issues and work closely with engineering and field support teams.

Requirements:

• Master's in Mechanical, Electrical, Electronics, Physics, or related Engineering disciplines.
• Excellent semiconductor process engineering background.
• Experience in process development, DOE, yield improvement, and process optimization.
• Exposure to front-end or back-end semiconductor manufacturing.
• Familiarity with data analysis tools such as JMP or MATLAB is advantageous.

EA License : 02C3423

EA Personnel : R22108699