Process Engineer, WETS (JR13578)

We are seeking a motivated and detail-oriented Buffered Oxide Etch Wafer Process Owner to own and optimize the BOE wet etch process used in wafer patterning and oxide opening applications. This role is responsible for ensuring precise, uniform, and repeatable oxide removal that supports accurate pattern transfer, high device quality, and strong manufacturing yield.

The successful candidate will work closely with lithography, etch, integration, metrology, yield, and manufacturing teams to maintain process stability, troubleshoot excursions, and drive continuous improvement.

• Support process characterization, qualification, and continuous improvement activities.
• Collaborate with lithography, etch, integration, yield, and quality teams to resolve process issues.
• Conduct root cause analysis for excursions, yield loss, and defectivity concerns.
• Support SPC monitoring, process capability improvement, and change control activities.
• Qualify new chemistries, equipment changes, and recipe updates as needed.
• Support technology transfers and new product introductions.

YOUR SKILLS & EXPERIENCES

• Bachelor’s or Master’s degree in Chemical Engineering, Materials Science, Chemistry, Physics, or a related field.
• At least 2 years experience in semiconductor wet processing, oxide etch, or pattern transfer applications.
• Strong understanding of BOE chemistry, wet etch behavior, and process control.
• Experience with root cause analysis, SPC, and DOE methodologies.
• Ability to work effectively in a cross-functional manufacturing environment.
• Strong analytical, communication, and problem-solving skills..