PROCESS ENGINEER (WIREBOND)
Summary
Process Engineer improves and maintains wire bonding techniques for semiconductor assembly, ensuring quality and stability for gold, silver, and copper wires.
Job Description:
- Develop new and improve existing gold, silver, and copper wire bonding process capability, stability, and quality
- Ensure wire bonding process meets customer’s specifications and requirements
- Conduct failure analysis to identity root cause of wire bonding failures and find solutions to prevent future failure
- Co-ordinate NPI and NPQ activities to meet given timeline
- Qualify new product, material, device, and machinery
- Participate in new tape development, and new material development activities
- Perform supplier sourcing and qualification activities jointly with purchasing and engineering team
- Benchmark new materials and new equipment technology in the market
- Train co-workers on new process implementation and new machinery operations
- Maintain, troubleshoot, and perform minor repair of assembly and test machinery
- Develop new and update existing Standard Operating Procedures
- Participate in internal audits, customers’ audits and external audits
- Comply with all quality, environmental, health, safety, and security policies and procedures of the Company
Job Requirements:
- Degree or Diploma in Engineering (preferably in electronic or material Science)
- Minimum 3 years working experience in a manufacturing environment (preferably in Semi-con assembly and test environment)
- Experience in operating ESEC, ASM, KNS wire bonders using Gold, Silver, and Copper wires
- Knowledgeable in the material science of bonding wires (gold, silver, copper), encapsulant epoxy, and structural substrates.
- Experience in IC assembly processes such as die attach, wire bond, encapsulation, and testing
- Experience in maintenance of die attach, wire bond, encapsulation, and testing machinery
- Able to multi-tasks and work in a fast-paced environment,
- Good team player, able to work independently, resourceful, willing to learn new skills, and has initiatives
- Knowledge in FMEA, SPC, OCAP, DOE, ISO9001:2000, ISO14001:2004, QEMS, CQM, JEDEC
- Good in problem solving, excellent interpersonal and communication skill