R & D Engineer – C/A and TCB
About the role
To lead the development, evaluation, and optimization of advanced Thermal Compression (TC) bonding and chip attach processes and equipment for next-generation advanced packaging technologies (e.g., chiplet integration, HBM, 2.5D/3D architectures). To establish robust bonding recipes, ensure precise co-planarity and alignment control, and successfully drive TC bonder tools from R&D concept validation to customer/internal qualification.
Key responsibilities
Advanced TC Bonding Process development for CoWoS PKG product family and CPO
Tool & Hardware Development / Qualification
Warpage & Co-planarity Control
Failure Analysis & Reliability Enhancement
Customer Development & Technology Transfer
Lead assigned projects
Yield Improvement & Yield Failure Analysis (FA)
About you
Bachelor's degree or higher in engineering or science (e.g., Material Science, Chemistry, chemical Engineering, Electronics, Advanced Materials, etc.)
R&D or mass production experience of at least three years in Thermal Compression Bonding (TCB), flip-chip assembly, or micro-bump bonding processes
Proven experience in driving customer development programs (e.g., JDP, customer qualification, technical evaluations) and managing customer requirements
Fundamental understanding of advanced semiconductor packaging processes, thermal-mechanical bonding behavior, and warpage control
Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting
Ability to prepare technical documents and deliver presentations to internal and external stakeholders
Proficiency in reading and writing technical documents in English