R & D Engineer – Plating/PR strip/Wet etch
- To research, develop, and qualify next-generation electroplating technologies (including fine-pitch RDL, Cu pillar, and micro-bump) to meet the requirements of advanced packaging technical roadmaps.
- To establish robust plating process windows, evaluate new chemistry and equipment, and drive technical solutions from early-stage R&D concepts to pilot-line qualification.
- Plating/Wet Process development for Adv. PKG product
- New Material, Chemistry & Equipment Development and Qualification
- Lead assigned Customer Development program
- Defect Analysis & Failure Analysis (FA)
- Technology Transfer & Documentation
Required Experience and Qualifications:
Bachelor’s degree or higher in engineering or science (e.g., Material Science, Chemistry, chemical Engineering, Electronics, Advanced Materials, etc.)
- R&D or mass production experience in at least three years of the following processes; plating, etching, stripping
- Fundamental understanding of advanced semiconductor fabrication processes
- Strong skills in experimental design, data analysis and technical reporting
- Ability to prepare technical documents and deliver presentations
- Proficiency in reading and writing technical documents in English
- Basic knowledge of equipment and materials used in semiconductor processSalary up to $6000
- Location: Yishun
- Mon To Fri 8am -518pm
JOB ID: JOB-00882
All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.
Kindly email your resume in a detailed Word format to [email protected]
We regret that only shortlisted candidates will be notified
People Profilers Pte Ltd
- 20 Cecil Street, #08-09, Plus Building, Singapore 049705
- Tel: 69509745
- EA Licence Number: 02C4944
- EA Registration Number: R1108448
- EA Personnel: Tan Lili Gesse