R & D Engineer – Plating/PR strip/Wet etch
About the role
To research, develop, and qualify next-generation electroplating technologies (including fine-pitch RDL, Cu pillar, and micro-bump) to meet the requirements of advanced packaging technical roadmaps. To establish robust plating process windows, evaluate new chemistry and equipment, and drive technical solutions from early-stage R&D concepts to pilot-line qualification.
Key responsibilities
Plating/Wet Process development for Adv. PKG product
New Material, Chemistry & Equipment Development and Qualification
Lead assigned Customer Development program
Defect Analysis & Failure Analysis (FA)
Technology Transfer & Documentation
About you
Bachelor's degree or higher in engineering or science (e.g., Material Science, Chemistry, chemical Engineering, Electronics, Advanced Materials, etc.)
R&D or mass production experience in at least three years of the following processes; plating, etching, stripping
Fundamental understanding of advanced semiconductor fabrication processes
Strong skills in experimental design, data analysis and technical reporting
Ability to prepare technical documents and deliver presentations
Proficiency in reading and writing technical documents in English
Basic knowledge of equipment and materials used in semiconductor process