韌體工程LEAD/經理 | FG14016237
Posted Updated 2
views
Description
MCU、C++、韌體開發、韌體設計
Embedded系統架構、
Motion/Motor Control、
通訊架構、
BSP/Driver、
軟硬整合、
技術審查及團隊帶領
Search jobs inside your AI agent. 
Connect over MCP — free, no account needed to search.
Connect Connect over MCP — free, no account needed to search.