韌體工程師 (CBU/PSU) Staff Firmware Design Engineer

To support our extraordinary teams who build great products and contribute to our growth, we're looking to add a Sr. Staff/Staff Firmware Design Engineer located in Taiwan Taipei Wugu Site. Firmware Design Engineer performs the responsibility for firmware design in Tier 1 CSP customer's CBU/PSU Projects request.

Here is a glimpse of what you'll do
1. Develop and implement embedded firmware for digitally controlled power conversion systems, including DC-DC converters, inverters, and AC-DC converters.
2. Responsible for control algorithm design, system integration, testing, and optimization to achieve high efficiency, reliability, and compliance with performance requirements.
3. Team player, work cross functionally with different teams to verify firmware meets system needs and requirements.
4. Participate in design validation testing, engineering builds (Proto/EVT/DVT/PVT), and system integration testing using ATE systems.

主要工作內容:

• 負責數位電源產品嵌入式韌體開發與維護。
• 設計與優化電源控制演算法，提升系統效率、穩定度及可靠性。
• 執行韌體整合、除錯、驗證及系統測試。
• 與硬體、系統及測試團隊跨部門合作，完成產品開發與導入。
• 參與 EVT／DVT／PVT 等產品驗證階段及量產導入。
• 使用 ATE 與相關測試工具進行功能與效能驗證。

Here is some of what you'll need:
1. Minimum 4 years of engineering experience in embedded firmware development for battery systems (BBU, UPS), SMPS, Pure-Sine Inverters and related industries.
2. Proficiency in C/C++ for embedded systems and real-time control firmware.
3. Solid experience with MCU/DSP platforms such as TI C2000, NXP MCX-N, or STM32 series.
4. Experience using MATLAB/Simulink or PLECS for control system modeling and design.
5. Experience developing BMS firmware for multi-cell or high voltage battery packs.
6. Experience debugging hardware and firmware interaction issues using oscilloscopes, logic analyzers, and debuggers (e.g., JTAG/SWD).
7. Experience developing common communication interfaces such as UART, SPI, I2C, and CANBUS for real-time data exchange, telemetry, and communication protocol implementation.
8. Experience developing bootloaders and firmware upgrade mechanisms.
9. Strong understanding of power topologies (buck, boost, half/full-bridge, LLC, PFC, inverter) and battery systems.
10. Excellent communication skills (verbal and written).
11. Problem solving and organizational skills.
12. Requires flexibility with working hours and business travel depending on projects demands.

我們期待您具備以下條件：
具 4 年以上嵌入式韌體開發經驗，曾參與 BBU、UPS、不斷電系統、純正弦波逆變器（Pure Sine Inverter）、SMPS 或相關電源產品開發。
熟悉 C/C++ 程式語言，具即時控制韌體開發經驗。
熟悉 TI C2000、NXP MCX 系列、STM32 或其他 MCU／DSP 平台開發。
具 MATLAB／Simulink 或 PLECS 控制系統建模與設計經驗。
具多串電池組或高壓電池系統 BMS韌體開發經驗。
熟悉硬體與韌體整合開發，具備使用示波器、邏輯分析儀及 JTAG／SWD 等除錯工具進行問題分析與排除的能力。
熟悉 UART、SPI、I²C、CAN Bus 等通訊介面開發與通訊協定實作。
具 Bootloader 及韌體升級機制開發經驗。
熟悉電源轉換拓撲架構，如 Buck、Boost、Half-Bridge、Full-Bridge、LLC、PFC 及 Inverter 等。
熟悉電池系統架構與相關控制原理。
具良好的中英文溝通能力、問題分析及解決能力。
能配合專案需求彈性調整工作時間及國內外出差。