Semicon R&D Engineer (Thermal Compression Bonding)
Purposeof the Job:
• To lead the development, evaluation, and optimization of advanced ThermalCompression (TC) bonding and chip attach processes and equipment fornext-generation advanced packaging technologies (e.g., chiplet integration,HBM, 2.5D/3D architectures).
• To establish robust bonding recipes, ensure precise co-planarity and alignmentcontrol, and successfully drive TC bonder tools from R&D concept validationto customer/internal qualification.
Job:
• Advanced TC Bonding Process development for CoWoS PKG product family and CPO
• Tool & Hardware Development / Qualification
• Warpage & Co-planarity Control
• Failure Analysis & Reliability Enhancement
• Customer Development & Technology Transfer
• Lead assigned projects
• Yield Improvement & Yield Failure Analysis (FA)
Requirement:
• Bachelor’s degree or higher in engineering or science (e.g., Material Science,Chemistry, chemical Engineering, Electronics, Advanced Materials, etc.)
• R&D or mass production experience of at least three years in ThermalCompression Bonding (TCB), flip-chip assembly, or micro-bump bonding processes
• Proven experience in driving customer development programs (e.g., JDP, customerqualification, technical evaluations) and managing customer requirements
• Fundamental understanding of advanced semiconductor packaging processes,thermal-mechanical bonding behavior, and warpage control
• Strong skills in experimental design (DoE), failure analysis (FA), andtechnical data reporting
• Ability to prepare technical documents and deliver presentations to internaland external stakeholders
• Proficiency in reading and writing technical documents
AllSuccessful candidates can expect a very competitive remuneration package and acomprehensive range of benefits.
Pleaseemail your resume in a detailed MS Word format to [email protected] stating
1)Current Drawn
2)Expecting Salary
3)Date Available
4)Reason to Leave each job:
Weregret that only shortlisted candidates will be notified
JoyceKoh Ai Leng
PeopleProfilers Pte Ltd
20Cecil St, #08-09, PLUS Building, Singapore 049705
Tel:6950 9737
www.peopleprofilers.com
EALicense Number: 02C4944
EAPersonnel Reg nos R1110618
JobID: JOB-00951