Senior Advanced Packaging Application Engineer (TCB)
Summary
Senior engineer optimizing Thermo Compression Bonding (TCB) processes for advanced semiconductor packaging like HBM and 3D/2.5D chiplet designs, troubleshooting alignment and yield issues.
Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding TCB)
Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : SGD 9,000 – SGD 10,000/month (Based on experience and technical capability).
Responsibilities:
Engage semiconductor customers to understand packaging roadmap, process requirements, throughput targets, yield and reliability challenges.
Support technical sales activities and customer discussions.
Benchmark competitor equipment and identify technology gaps.
Translate customer requirements into internal equipment specifications.
Develop and optimize TCB process parameters on TCB Equipments.
Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration.
Troubleshoot bonding issues such as non-wet, misalignment, voids, delamination and warpage.
Conduct DOE and process characterization activities.
Work closely with Mechanical, Software, Electrical, Motion and Vision teams.
Define alignment accuracy, thermal performance, bond force profiles, throughput targets and process windows.
Lead machine qualification, FAT and SAT activities.
Act as the internal customer during machine development.
Support customer buyoff and onsite qualification activities.
Requirements:
Bachelor’s or Master’s Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Semiconductor Engineering or related fields.
5–15 years of semiconductor packaging experience preferred.
Hands-on experience in TCB, Flip Chip and Advanced Packaging.
Experience in HBM / CoWoS / 2.5D / 3D packaging.
Experience in OSAT, IDM or semiconductor equipment environments preferred.
Experience with fluxless or N2 bonding environment is an advantage.
Strong understanding of Thermo Compression Bonding (TCB), Flip Chip processes, thermal management, warpage control, alignment systems, vision systems, process qualification, SPC and yield analysis.
Experience with DOE, statistical analysis tools, failure analysis workflows and semiconductor process characterization.
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