Senior / Associate Process Engineer - Wafer Backgrind, Laser Mark, Wafer Saw
STATS CHIPPAC PTE. LTD. Senior / Associate Process Engineer - Wafer Backgrind, Laser Mark, Wafer Saw
Description
About us
STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.
About the role
Provide process engineering support on the following Backend2 process: (1) Wafer Backgrind (2) Laser Mark (3) Wafer Saw and process operational issues as per guidance of Process Engineer.
Key responsibilities
Perform production line sustaining to ensure all the processes are running without any quality issue
Follow up the process improvement projects which assigned by Process Engineer
Characterize new devices and create recipes in the machine.
Immediate response to investigate and analyze products with problem
Cross support with line supervisor to clear real time bottleneck that impact cycle time and quality
Cross support with other Associate Engineer to clear equipment downtime
Communicate with Engineers and external vendors to resolve problems and provide advanced training to less experienced Technical Specialists or Manufacturing Specialists
What we're looking for
Diploma or Degree in Electric & Electronic, Mechanical & Mechatronics, Physics Engineering or equivalent
2 years of relevant experience in EWLB or WLCSP are preferred
Positive mindset with ability to adapt to fast-paced working environment
Ability to work on 12 hours rotating shift