Senior Director CAD & Design Methodology

You lead the end-to-end ASIC design methodology, engineering infrastructure, and CAD organization. You define tools, automation, and workflows from RTL through signoff, packaging integration, and tapeout; manage EDA tools and licensing; build infrastructure and CI systems; and mentor and scale the CAD and methodology organization.

Responsibilities

• Architect and own the end-to-end ASIC development methodology
• Establish scalable and reproducible design flows across RTL verification synthesis DFT physical design STA physical verification release management and silicon bring-up support
• Lead the evaluation selection deployment and integration of EDA tools
• Define the engineering infrastructure strategy for compute storage networking cloud resources scheduling security backup and disaster recovery
• Build automation frameworks CI/CD pipelines regression systems dashboards and engineering workflows
• Own EDA licensing strategy vendor relationships procurement budgets IP administration and license compliance
• Partner with architecture RTL verification physical design packaging software and IT teams
• Build mentor and scale the CAD and methodology organization

Requirements

• Deep understanding of the complete ASIC development lifecycle from architecture and RTL through tapeout
• Experience developing and owning design methodologies across multiple successful SoC programs
• Hands-on experience with EDA ecosystems from multiple vendors such as Synopsys Cadence Siemens EDA and Ansys
• Strong understanding of engineering compute infrastructure distributed scheduling storage systems cloud environments and license management
• Excellent scripting and automation skills using Python Tcl Bash or similar
• Strong knowledge of version control continuous integration regression management and reproducible engineering practices
• Ability to make technical and business decisions involving tools infrastructure budgets licensing and engineering investment
• Exceptional organizational and leadership skills
• Excellent communication skills and ability to influence senior technical leaders across disciplines
• Experience with advanced technology nodes N3 N2 or beyond
• Experience building CAD organizations in an early-stage semiconductor company
• Familiarity with AI-assisted engineering workflows and next-generation design automation
• Experience supporting chiplet-based designs or advanced packaging

Benefits

• Equity participation
• Medical coverage
• Dental coverage
• Vision coverage
• Paid time off
• Flexible work arrangements