Senior Engineer, APTD Operations

Operations Management

• Handle technology development and engineering builds in partnership with internal and external teams such as process, equipment, metro RDA, site planning and manufacturing.

• Define and execute build plans, priorities, milestones, and schedules with cross-functional stakeholders.

• Align plans, dependencies, and deliverables to ensure timely, cohesive execution to meet program requirements.

• Forecast build, material, cost, and resource requirements, maintaining accurate planning data and tools. Drive for the resource readiness and ensure timely availability of required resources to support TD projects.

• Optimize build schedules, material preparation, and logistics to align with business priorities and minimize waste and delays.

• Supervise daily execution, including wafer offloading, kitting, and support of TD builds.

• Support the logistics tasks as needed according to project requirements (Materials sending/receiving, submit the sample for failure analysis etc.

• Coordinate engineering builds and APTD operations in compliance with established standards and processes.

• Facilitate regular reviews and meetings to track progress and address challenges for the operation readiness.

• Monitor and communicate the status and overall health to stakeholders.

• Lead cross-functional improvement initiatives and build strong stakeholder partnerships across programs.

• Proactively identify and resolve risks, issues, and roadblocks, escalate as needed to protect timelines.

• Centralize and manage project documentation and data using SharePoint and Confluence.

• Ensure all deliverables and artifacts meet program requirements and align with established business processes
  
  

  AI Responsibilities:

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.
  

  
  Education and Experience

• Bachelor’s or master’s degree or equivalent experience in Materials, Mechanical, Chemical, or Electrical/Electronic Engineering.

• 3-5+ years’ experience in Semiconductor Frontend/Backend Manufacturing, preferably minimum 1 year of HBM experience

• Experience in Project/Process Integration, Project/Program Management, Technology Development, Operations Management, or Process Engineering.

• Solid understanding of advanced packaging flows

• Proficiency in essential computer applications, including Excel, Word, statistical tools, Confluence, Power BI, and Power Apps.

• Knowledge of SAP, Teamcenter and manufacturing execution systems.

• Knowledge of Project Management Tools/Systems.

• Strong analytical and problem-solving capabilities.

• Outstanding communication, leadership, and stakeholder management skills.

• Ability to work independently and collaboratively in a fast-paced environment.

• Demonstrated excellence in leading teams within a global manufacturing network composed of members from diverse fields and cultures.