SENIOR ENGINEER FRONT END(FE) CENTRAL PROCESS INTEGRATION ENGINEERING (CPIE) PI
As FE CPIE CPI PI Senior Engineer at Micron Technology, Inc., you will be responsible for working with global Micron network to drive each silicon node's Packaging Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution.
In addition, you will be responsible in integrating solutions by connecting cross-functional expertise, standardizing the business process and regularly benchmarking internal and external intelligence to achieve the highest value bits and productivity.
In addition, you will leverage AI-enabled engineering approaches, advanced analytics, and digital tools to accelerate problem solving, improve productivity, enhance decision quality, and drive continuous innovation across product yield, quality, and business processes.
Responsibilities and Tasks
Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.
Define strategies to ensure that Packaging Technology and interaction with Front End manufacturing process are fully developed and qualified well ahead of any qualification of the product itself.
Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance.
Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach.
Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary.
Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals.
Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles.
Travel to Micron Fab locations as necessary for face-to-face work.
Drive AI and digital transformation initiatives by leveraging AI-powered tools, data analytics, automation solutions, and intelligent workflows to improve engineering efficiency, accelerate root cause analysis, enhance decision-making, and increase organizational productivity.
Requirements
Bachelor’s or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering or related field .
5 years relevant experience in Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test and probe yield.
3 years relevant experience on DRAM High Performance Memory(HPM), BEOL integration, advanced packaging and layout.
Good data analysis, troubleshoot, problem solving, reporting and presentation skills with a strong attention to detail in Semiconductor Industry.
Good multi-tasking, verbal, and written communication skills.
Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.
Good organizational capabilities and ability to work effectively with minimal supervision.
Intermediate to advanced proficiency in Microsoft Office, AI-enabled productivity tools (e.g., Microsoft Copilot), and digital collaboration platforms.
Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.
Travel Required: Yes. Willing to travel as needed to support department goals
Travel Frequency: 20-50%.
Experience or strong aptitude in utilizing AI, data analytics, and digital technologies to enhance engineering decision-making, operational efficiency, and cross-functional collaboration.