Senior Manager, Systems Engineer
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Description
The Senior Manager, Systems Engineering will lead the Singapore-based Systems Engineering team within Applied Materials' Advanced Packaging business. This role is responsible for driving the development of next-generation semiconductor equipment, leading cross-functional engineering programs, and building regional technical capabilities to support global R&D and product roadmaps.
Key Responsibilities
- Lead and develop a high-performing Systems Engineering team supporting new product development and sustaining engineering activities.
- Drive system architecture, electrical design, controls integration, and qualification of semiconductor equipment for advanced packaging applications.
- Lead cross-functional programs from concept through product release, ensuring delivery of performance, quality, cost, and schedule objectives.
- Partner with global R&D, Product Management, Manufacturing, and Field organizations to develop and commercialize innovative technology solutions.
- Drive continuous improvement, controls modernization, and product enhancement initiatives across existing and next-generation platforms.
- Ensure compliance with SEMI, safety, electrical, and regulatory requirements.
- Develop organizational capability through talent acquisition, coaching, succession planning, and employee development.
- Manage departmental priorities, resources, and budgets to support business objectives.
Minimum Qualifications
- PhD, Master's Degree or Bachelor's degree in Electrical Engineering, Systems Engineering, Mechatronics, or a related technical discipline.
- 12+ years of experience in semiconductor equipment, semiconductor manufacturing, or related high-technology industries.
- 5+ years of engineering leadership experience managing technical teams and complex development programs.
- Proven track record in system design, product development, and commercialization of semiconductor equipment.
- Strong expertise in systems engineering, electrical controls, automation, equipment integration, and problem solving.
- Experience in Advanced Packaging, Hybrid Bonding, PVD, Etch, Thermal Processing, Metrology, or related semiconductor technologies.
Work Location
Science Park II (Moving to Tampines office from mid-2027)