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JABIL CIRCUIT (SINGAPORE) PTE. LTD.

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Senior SMT PCBA Manufacturing / Process Engineer

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Jabil

Senior SMT PCBA Manufacturing / Process Engineer

  • The Senior SMT PCBA Manufacturing / Process Engineer is responsible for developing, optimizing, and sustaining Surface Mount Technology (SMT) and Printed Circuit Board Assembly (PCBA) manufacturing processes to achieve world-class performance in quality, cost, delivery, and productivity. The role provides technical leadership for NPI, process validation, yield improvement, equipment qualification, automation initiatives, and continuous improvement projects while supporting high-volume production and customer requirements.

Key Responsibilities

1. Process Engineering & Manufacturing Support

▪ Own SMT and PCBA manufacturing processes from stencil printing through reflow, AOI, SPI, selective soldering, wave soldering, depanelization, coating, and final assembly.

▪ Develop and maintain process flows, control plans, PFMEA, work instructions, and process specifications.

▪ Lead process troubleshooting and root cause investigations for manufacturing issues.

▪ Drive yield, throughput, and cycle-time improvement initiatives.

▪ Establish process controls to ensure stable and repeatable production performance.

▪ Monitor process capability (Cp/Cpk) and implement corrective actions when required.

2. New Product Introduction (NPI)

▪ Lead DFM and DFA reviews during product development.

▪ Support manufacturing readiness activities for new product introduction.

▪ Define manufacturing process requirements, tooling, fixtures, and equipment.

▪ Lead pilot builds, engineering builds, and production ramp-up activities.

▪ Develop manufacturing documentation and train production personnel.

▪ Manage product transfer activities between sites or customers.

3. SMT Process Optimization

▪ Optimize the following process areas: solder paste printing, placement processes, reflow profiles, AOI inspection programs, SPI inspection strategies, selective soldering parameters, and wave soldering parameters.

▪ Establish process windows and operating limits.

▪ Improve first-pass yield and reduce defect opportunities.

▪ Analyze defect trends and implement sustainable corrective actions.

4. Equipment & Automation

▪ Lead equipment selection, qualification, installation, and commissioning.

▪ Support SMT printers, pick-and-place machines, reflow ovens, SPI systems, AOI systems, X-Ray systems, and selective soldering equipment.

▪ Develop and implement automation solutions to improve productivity.

▪ Support Industry 4.0 manufacturing initiatives and digitalization programs.

5. Quality & Validation

▪ Lead IQ, OQ, PQ, Process Validation, and Test Method Validation activities.

▪ Perform Gauge R&R, MSA, SPC, and process capability studies.

▪ Review and update PFMEA, Control Plans, and Risk Assessments.

▪ Support customer, ISO, and regulatory audits.

▪ Ensure compliance with IPC standards and customer requirements.

6. Continuous Improvement

▪ Lead Lean Manufacturing initiatives.

▪ Facilitate DMAIC projects, Kaizen events, Value Stream Mapping, and OEE improvement projects.

▪ Drive cost reduction through yield improvement, labor optimization, material savings, automation, and cycle-time reduction.

▪ Establish KPI dashboards and performance monitoring systems.

7. Technical Leadership

▪ Mentor Process Engineers and Manufacturing Engineers.

▪ Provide technical coaching to technicians and production teams.

▪ Lead cross-functional problem-solving activities.

▪ Interface directly with customers regarding technical challenges and improvement initiatives.

▪ Lead engineering reviews and manufacturing readiness assessments.

Technical Requirements

SMT & PCBA Expertise

Strong technical knowledge of:

▪ SMT process development

▪ Stencil design and solder paste technology

▪ Pick-and-place programming

▪ Reflow profiling and optimization

▪ AOI and SPI systems

▪ X-Ray inspection techniques

▪ Wave soldering

▪ Selective soldering

▪ PCB defect analysis

▪ Conformal coating processes

▪ PCBA assembly technologies

Engineering Tools

Proficiency in:

▪ SPC and Minitab

▪ DMAIC and Lean Six Sigma

▪ PFMEA, Process Flow Diagrams, and Control Plans

▪ 8D Methodology, Fishbone Analysis, and 5 Why Analysis

▪ Time Study and Capacity Analysis

▪ AutoCAD (preferred)

▪ MES and manufacturing systems

Quality & Compliance

Strong understanding of:

▪ IPC-A-610

▪ IPC J-STD-001

▪ IPC-7711/7721

▪ ISO 9001

▪ ISO 13485 (preferred)

▪ FDA 21 CFR Part 820 (preferred)

▪ ESD control programs

▪ Change control systems

▪ CAPA processes

Education & Experience

Education

▪ Bachelor's Degree in Electronics, Electrical, Manufacturing, Mechanical, Industrial Engineering, or a related engineering discipline.

Minimum Experience

▪ 8+ years of SMT/PCBA manufacturing engineering experience.

▪ Minimum 5 years supporting high-volume SMT production.

▪ Experience with NPI, process validation, and yield improvement.

Preferred Experience

▪ 10+ years in electronics manufacturing services (EMS).

▪ Experience in a major EMS or equivalent high-mix electronics manufacturing environment.

▪ Lean Six Sigma Green Belt or Black Belt certification.

▪ Experience leading manufacturing transfer projects and multi-site deployments.

Key Performance Indicators

▪ First Pass Yield (FPY)

▪ Defect Rate (DPMO/PPM)

▪ OEE Improvement

▪ SMT Placement Efficiency

▪ Reflow Yield

▪ Cost Reduction Achievement

▪ Cycle Time Reduction

▪ NPI Ramp Success

▪ Corrective Action Closure

▪ Customer Quality Performance

▪ Equipment Utilization

Skills

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See also

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