Senior Thermal Design Engineer

THE ROLE:

Join AMD’s Data Center Platform Engineering Group (DPEG) Thermal Mechanical Engineering team and help shape the cooling technologies behind next-generation Data Center GPU products. In this highly collaborative, hands-on environment, you will work with silicon, package, board, power, validation, manufacturing, and external partner teams to transform product requirements into high-performance, reliable, and scalable thermal solutions.

This role offers the opportunity to work across the full product lifecycle, from early concept and computational modeling through cold-plate development, laboratory validation, and production. You will deepen your expertise in advanced liquid cooling, electronics thermal management, and GPU platform design while contributing to one of AMD’s most strategic growth areas.

THE PERSON:

You are a technically curious and collaborative engineer who enjoys solving complex thermal challenges and turning analysis into practical product solutions. You communicate clearly across engineering disciplines, balance multiple priorities, and are comfortable working directly with internal teams and external vendors. You bring strong ownership, sound engineering judgment, attention to detail, and a willingness to learn new tools and cooling technologies in a fast-paced product-development environment.

KEY RESPONSIBILITIES:

• Design and develop thermal solutions for next-generation AMD Data Center GPU products, with an emphasis on liquid cooling and cold-plate technologies.

• Build and analyze thermal and CFD models using tools such as ANSYS Icepak, AEDT, or equivalent, and translate results into actionable design recommendations.

• Partner with silicon, package, board, power, mechanical, validation, manufacturing, and vendor teams to deliver chip-, card-, and system-level thermal-mechanical solutions.

• Support thermal characterization and hands-on laboratory validation, including correlation of simulation results with physical test data and resolution of performance gaps.

• Drive thermal design activities across the product lifecycle, from initial requirements and concept development through qualification and production readiness.

• Evaluate emerging cooling technologies, components, and supplier capabilities to support future product roadmaps and scalable data center solutions.

• Within the first 90 days, learn the team’s tools, products, and development processes and begin contributing to simulation, design, or validation activities.

• Within the first year, independently own thermal deliverables for an assigned product or project and contribute to team knowledge sharing and mentoring.

PREFERRED EXPERIENCE:

• Strong foundation in heat transfer, fluid dynamics, and electronics cooling.

• Experience with computational fluid dynamics and thermal-analysis tools such as ANSYS Icepak, AEDT, Fluent, or equivalent. Candidates with strong fundamentals and experience using comparable tools are encouraged to apply.

• Knowledge of air- and liquid-cooling technologies, including cold plates and thermal management for high-power electronics.

• Familiarity with thermal-management components such as thermal interface materials, heat sinks, vapor chambers, heat pipes, fans, and liquid distribution systems.

• Experience with GPU, server, rack, data center, semiconductor, or other high-performance electronics thermal design is desired.

• Hands-on thermal laboratory testing, instrumentation, data analysis, and simulation-to-test correlation experience.

• Familiarity with CAD tools such as Creo or SolidWorks and scripting or analysis tools such as Python, MATLAB, C, or C++ is a plus.

• Experience collaborating with cross-functional engineering teams and external vendors or suppliers.

ACADEMIC CREDENTIALS:

• BS, MS, or PhD in Mechanical Engineering, Aerospace Engineering, Thermal Engineering, or a related engineering discipline is preferred.

LOCATION: Secaucus, New Jersey. (Onsite)

This role is not eligible for visa sponsorship.

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