蝕刻製程開發工程師(R&D DRAM Dry Etch Process Development Engineer)

R&D Pilot Line Fab

• Updating the Fab engineers on customer issues and technology needs.
• Supporting root cause defect and unique fail mode analysis.

Process Integration

• Delivering advanced technology to meet future product nodes.
• Developing recipes to meet structural & electrical requirements.
• Managing wafers though Dry Etch levels in support of special requirements.

Other Process Areas

• Working in cross-functional teams to jointly develop device structures.
• Supporting cross-functional failure analysis and yield improvement.

Dry Etch peers

• Maintaining or developing expertise in multiple process, hardware, or technology areas.
• Serving as a resource for peers in recipe & process development.

Qualifications:

• Understanding in: Transport phenomena, Electromagnetics, Atomic/Molecular physics, and Surface phenomena
• Solid trouble shooting, experimental design and data analysis skills
• Strong computer skills, including MS Office
• Basic understanding of plasma sources used in plasma etching
• Understanding in the principles of dry etch processing
• Rudimentary understanding of process control and Statistical Process Control (SPC)

Education/Experience:
MS/PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics
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