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Molex Taiwan Ltd._台灣莫仕股份有限公司

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Silicon Photonic Product Design Engineer 矽光子研發工程師 (地點:新竹) #191075

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Description

Your Job

  • Molex is seeking a Silicon Photonics Product Design Engineer to join our Optical Solutions Business Unit (OSBU). In this role, you will own the design, integration, and productization of Photonic Integrated Circuits (PICs) based on established silicon photonics platforms and PDKs. You will translate customer and module requirements into manufacturable PIC solutions and drive execution from architecture definition, tape-out, validation, qualification, and production release.

Our Team

  • R&D Optoelectronic Solutions

What You Will Do

  • Lead PIC integration design and product architecture development based on customer and product requirements.
  • Own PIC design specifications and technical documentation for layout implementation, mask tape-out, module design, and product qualification.
  • Define manufacturing requirements and process flows across CMOS foundry, assembly, testing, and KGD operations.
  • Drive cross-functional technical execution, risk management, failure analysis (FA), yield improvement, and issue resolution throughout the product lifecycle.
  • Serve as the primary technical interface with customers, foundries, OSATs, suppliers, and internal stakeholders.
  • Partner with Program Management to ensure successful program execution, resource planning, manufacturing strategy, and product delivery.

Who You Are (Basic Qualifications)

  • Master’s degree in physics, Semiconductor Engineering, Optics, Optoelectronics, or a related field.
  • 2+ year of experience in the optical communications industry and/or relevant academic research projects.
  • Working knowledge of silicon photonics circuit design, optical routing, and component integration.
  • Working-level English communication skills, including listening, speaking, reading, and writing
  • Strong collaboration, communication, and problem-solving skills.

What Will Put You Ahead

  • Experience in silicon photonics PIC design, integration, and product development.
  • Experience in IC/PIC new product introduction (NPI) and manufacturing ramp-up.
  • Experience with silicon photonics component design and PIC integration using established PDK platforms.
  • Experience with CMOS IC tape-out, wafer fabrication, or process integration, or foundry interactions.
  • Experience working with cross-functional teams across design, process, test, packaging, and manufacturing.
  • Familiarity with yield analysis, failure analysis (FA), qualification, and manufacturing readiness activities.

Skills

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