Silicon Photonics Test Engineer _ Silicon Photonic (Taipei)

We are seeking a Test Engineer with experience in silicon photonics, optical/electrical measurement, test automation, and engineering validation to support the development of photonic devices, photonic integrated circuits (PICs), and related modules. This role will focus on wafer-level testing, chip-level testing, measurement platform development and evaluation, test specification and method definition, data analysis, and reliability characterization.
The engineer will work closely with design, process, packaging, system, and mechanical teams to establish robust test methodologies, improve measurement capability, and support product development from prototype validation through engineering qualification. The role also requires familiarity with 3D CAD tools to support fixture design, test platform integration, and mechanical design collaboration.

Key Responsibilities
1. Develop, maintain, and optimize optical and electrical test platforms for wafer-level, chip-level, module-level, and system-level evaluation of silicon photonics devices and PICs, including platform qualification, instrument configuration, alignment approach, and scalability assessment.
2. Execute wafer test, chip test, device characterization, and system-level validation according to product requirements and development milestones, covering optical, electrical, and electro-optical performance metrics such as insertion loss, coupling efficiency, wavelength response, polarization dependence, and beam performance.
3. Define and document measurement specifications, test methods, test plans, SOPs, and acceptance criteria to establish standardized and reusable validation processes for photonic devices and PICs.
4. Develop and improve test automation, data acquisition, and control workflows, and analyze measurement results to identify trends, anomalies, and technical issues, providing clear reports and recommendations to support design improvement and engineering decisions.
5. Establish correlation, repeatability, and reproducibility studies across wafer, chip, package, and system levels, and support failure analysis and root-cause investigation by correlating test data with design, process, packaging, and system integration conditions.
6. Plan and execute reliability testing and engineering validation activities, including thermal, environmental, stress, lifetime-related measurements, sample bring-up, and new product introduction support.
7. Collaborate with packaging, mechanical, and cross-functional engineering teams to support test fixture design, platform integration, and mechanical interface evaluation, and use 3D CAD tools such as Pro/ENGINEER (Creo), SolidWorks, or equivalent software to assist in fixture development and test setup implementation.