Sr. Assembly Package Engineer (Co-design)

1. Collaborate with OSATs' engineering/substrate design team and IC designer/SIPI team to deliver robust package design solutions.
2. Participate IC package substrate design review, and initiate package specs and documentations.
3. Work with DE/ELE/SIPI/PM/OSATs for prototype build, package characterization and related simulation.
4. Provide IC package solution supporting pre-sales activity.
5. Timely respond package related inquiries from customer/PM.