Leadership Roles and Responsibilities

• Lead the development and execution of the SiC power module technology roadmap supporting high-voltage and ultra-high-voltage product platforms.
• Build, lead, and develop a global organization of package, module, materials, process, reliability, and manufacturing engineers.
• Drive the development of advanced power module packaging technologies from concept and prototype through qualification, safe launch, manufacturing ramp, and production release.
• Establish module architectures, design rules, material strategies, and assembly processes that enable industry-leading performance, reliability, manufacturability, and cost.
• Own technical execution of power module development programs across all development phases and applicable product development gates.
• Lead development activities at OSAT partners, ensuring process capability, quality, capacity readiness, documentation, and operational execution.
• Drive design-for-manufacturing, design-for-reliability, design-for-test, and technical risk mitigation throughout the product development cycle.
• Establish robust package and module development methods, including requirements management, DFMEA, design reviews, qualification plans, technology readiness assessments, and manufacturing readiness reviews.
• Partner with Product Engineering, Device Engineering, Test Engineering, Quality, Supply Chain, Operations, and Business Units to ensure successful product execution.
• Define the long-term OSAT strategy, including technology capability development, supplier qualification, capacity planning, and second-source initiatives.
• Serve as the senior technical interface with customers, suppliers, and manufacturing partners for SiC power module technologies.
• Drive continuous improvement in quality, yield, cycle time, cost, and operational performance across module manufacturing operations.

Technical Roles and Responsibilities

• Define the technology roadmap for next-generation SiC power modules supporting 1.2kV through ultra-high-voltage platforms 2.3kV and higher.
• Lead development of advanced module architectures, including substrate technologies, high-voltage isolation systems, terminal designs, interconnect structures, current-sharing approaches, and thermal-management solutions.
• Establish module electrical, thermal, mechanical, reliability, manufacturability, and cost requirements and lead engineering tradeoff decisions throughout development.
• Drive selection, characterization, and qualification of AMB and DBC substrates; die-attach and sintering materials; wire, ribbon, and clip interconnects; molding and encapsulation materials; thermal-interface materials; housings; and high-voltage insulation systems.
• Lead electrical, electro-thermal, thermal, and mechanical simulation activities, including parasitic extraction, finite-element analysis, stress and warpage modeling, electric-field analysis, power-cycling life prediction, and partial-discharge assessment.
• Define assembly process technologies, specifications, controls, and process windows for die attach and sintering, substrate attach, wire and ribbon bonding, clip attach, encapsulation, transfer molding, housing assembly, cleaning, curing, marking, and traceability.
• Drive structured design of experiments, process characterization, SPC, Cpk improvement, defect reduction, and manufacturing yield improvement at OSATs.
• Lead root-cause analysis and corrective actions for complex module failures, including delamination, die-attach voiding, sinter fatigue, interconnect degradation, thermal runaway, insulation breakdown, partial-discharge failures, moisture ingress, and housing or substrate cracking.
• Work with test engineering to define wafer-sort, known-good-die, wafer-level burn-in, reliability screening, module final-test, high-voltage isolation, and partial-discharge test strategies
• Lead technical evaluations and qualifications of OSATs, substrate suppliers, assembly-equipment vendors, material suppliers, and external reliability laboratories.
• Own technical release criteria, control plans, safe-launch requirements, manufacturing readiness, and post-release monitoring for new module platforms.
• Serve as the company technical authority for SiC power module architecture, packaging materials, assembly processes, qualification strategy, reliability, and manufacturing readiness.