Sr. Manager, Engineering

Responsabilidades

Essential Functions/Responsibilities:

1. Research and implementation of new technology , new processes , roadmaps, NPI for die processing services
2. Monitor and improve throughput, quality, yield, and uptime of wafer plating equipment/processes.
3. Continuous improvement
4. Update and maintain documentation for all new NTI-NPI technology
5. Facilitate necessary experiments (DOE format) to troubleshoot quality issues.

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Experiencia y Habilidades Requeridas

Education:

1. Bachelors or Masters in Mechanical/ Chemical or industrial engineering
2. Job experience or other technical / engineering education can be substituted for educational preferences.

Required Skills:

1. 1+ years of hands-on-experience with die processes services ( die mechanical sawing / laser process ( stealth -plasma dicing) / back grinding , Tape & reel die Automatic optical inspection ) for GaAs , Si die etc
2. understanding of die processing equipment, and processes.
3. troubleshooting, analytical and problem-solving skills. & process control fundamental understanding
4. Ability to analyze statistical data; familiarity with software such as JMP is preferred.
5. Good communication and interpersonal skills for working with multiple engineering groups and customers.
6. English level >85%
7. Able to travel immediately

Experiencia y Habilidades Deseadas

Desired Skills and Experience:

1. 5+ years of experience in die processing services
2. 2+ years of production operations experience, particularly in high volume manufacturing.
3. Ability to apply fundamental theories in real engineering problem solving.

Industry or R&D manufacturing experience with die processing