Sr. Technical Program Manager
Posted Updated
Summary
Senior Technical Program Manager at Amazon Devices (Shanghai) owning the reuse of custom edge-AI SoCs: driving SoC and software readiness (drivers, firmware, BSP, ML runtime, power/performance tuning) for new products built on existing Amazon silicon, and leading silicon health programs from first production through end of life.
Amazon Devices builds custom silicon for edge AI products. Each SoC we ship it gets reused in new products, extended with new software features, and supported in production for years. We are looking for a Sr. Technical Program Manager to own that phase: drive SoC and software execution for new products built on existing Amazon silicon, and lead the program for silicon health from first production through end of life.
In this role you will also work backwards from launch KPIs for each new product intercept. You will plan and drive the SoC software work needed to bring new features to those products, and partner with production engineering as needed over the life of the chip.
You will also turn what each program teaches us into reusable playbooks and share best practices across the TPM community.
Key job responsibilities
* Drive SoC and software readiness for new products adopting an existing Amazon SoC, from requirements and gap analysis through xVT and launch.
* Work with product-line device software and device OS teams to scope, plan, and deliver new SoC software features (drivers, firmware, BSP, ML runtime enablement, power/performance tuning) without destabilizing products already in market.
* Define hand-off criteria, milestone metrics, and tracking tools within PDP for intercept programs. Contribute to risk trade-offs and milestone acceptance decisions.
* Support product teams with silicon characterization, hardware, and validation data for xVT integration.
In this role you will also work backwards from launch KPIs for each new product intercept. You will plan and drive the SoC software work needed to bring new features to those products, and partner with production engineering as needed over the life of the chip.
You will also turn what each program teaches us into reusable playbooks and share best practices across the TPM community.
Key job responsibilities
* Drive SoC and software readiness for new products adopting an existing Amazon SoC, from requirements and gap analysis through xVT and launch.
* Work with product-line device software and device OS teams to scope, plan, and deliver new SoC software features (drivers, firmware, BSP, ML runtime enablement, power/performance tuning) without destabilizing products already in market.
* Define hand-off criteria, milestone metrics, and tracking tools within PDP for intercept programs. Contribute to risk trade-offs and milestone acceptance decisions.
* Support product teams with silicon characterization, hardware, and validation data for xVT integration.
