Staff Process Engineer (Plasma)
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- Primary owner for plasma etching processes(GaN/SiO2/SiN/ALD film) in ICP chambers .
- Carry out improvement activities related to plasma etching topic (cycle time improvement, CPk improvement, scrap reduction, etag reduction, troughput improvement, cost reduction, new tool start-up and etc).
- Analyze root causes for any process deviations, defects, and yield losses topics related to plasma processes/tools.
- Providing resolution(corrective/preventive action plan) to process issues related to plasma etching.
- Monitor SPC chart and provide improvement plan to ensure Cpk > 1.67
- Maintain and update Standard Operating Procedures (SOPs), process specification, Out of Control Plan(OCAP), FMEA and ECP documents.
- Attend MRB for non-coformance lot disposition and follow up on 8D topic.