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Energy Jobline ATTB

System IC Architect - Advanced Power Systems in , us

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Job Description

We are seeking a visionary System IC Architect with deep expertise in system-level architecture, high-performance power conversion, and semiconductor packaging technologies. This role is pivotal in defining next- Point of Load (PoL) solutions for APS, driving innovation in advanced power management with System-in-Package (SiP) integration.

We're looking for a candidate to define products, shape architecture strategy, and support the launch of Point-of-Load (PoL) power solutions that meet latest system-level requirements. Key focus areas include high-performance core power for automotive applications and AI compute platforms. The role centers on Advanced Power Management for PoL solutions. Expertise in AI compute power is essential, and experience in automotive power management is a strong plus.

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their , , , , (including ), , and expression, marital status, , ancestry, genetic factors, , , protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a during the application or recruiting process, please send a request to HR@insightglobal.com.To learn more about how we collect, keep, and process your private information, please review Insight Global's Workforce Privacy Policy: .

Skills and Requirements

Master's degree in Power Electronics, Electrical Engineering, or related field (Ph.D. ).

15+ years of experience in power semiconductors, packaging, and system-level integration. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions. Expertise in System-in-Package (SiP) integration is essential.

Proven track record in product definition through revenue realization.

Strong expertise in thermal management, electrical performance, and advanced reliability.

Proficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS) and knowledge of PCB materials and stack-up.

Experience in Powering high performance compute SoC platforms, with automotive-grade standards highly valued.

Experience in systems developed according to Functional Safety standard is a plus (ISO26262 and/or IEC61508).

Demonstrated ability to lead cross-functional, global teams and manage complex projects.

Excellent communication and interpersonal skills; ability to collaborate across diverse teams.

Creative mindset with strong problem-solving capabilities.

Willingness to travel domestically and globally - 10% of the time

Skills

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