Technical Program Manager III
Summary
Lead complex hardware NPI projects for Google's Devices & Services team, managing quality plans from prototype to mass production. You will partner with cross-functional teams to resolve defects, manage contract manufacturers, and ensure product quality for consumer electronics using tools like DFMEA, DfX, and structured problem-solving (8D, 5-Why).
- Establish and enforce NPI Quality Plans across development milestones (Proto, EVT, DVT, PVT, ramp), defining exit criteria, tracking line health, and assessing ramp readiness.
- Partner with cross-functional teams to enable a design for quality/manufacturability, reviewing DfX deliverables and integrating engineering DFMEAs into factory process controls and test plans.
- Lead cross-functional teams to resolve build defects, cosmetic fallout, and component failures using structured problem-solving (8D, 5-Why, Fishbone).
- Drive end-to-end user experience quality targets, including out-of-box experience (OOBE), cosmetic acceptance criteria, and field return rate projections.
- Provide executive communication on quality status, yield performance, defect tracking, and launch readiness.
Minimum qualifications:
- Bachelor's degree in a technical field, or equivalent practical experience.
- 5 years of experience in program management.
- Experience managing devices and services or electromechanical consumer products quality through full NPI lifecycles (Proto/EVT through PVT, mass production ramp, and commercial launch).
- Experience managing Contract Manufacturers and suppliers, and establishing and managing key quality metrics (OOBE, field return projections, line yield, Cpk/Ppk).
- Ability to travel internationally up to 25% to manufacturing sites during critical NPI build cycles.
Preferred qualifications:
- Master’s degree in Engineering.
- 8 years of experience managing hardware quality for complex wearable health trackers or connected devices.
- Understanding of high-volume manufacturing processes (tooling, molding, stamping, SMT, final assembly, and functional testing).
- Knowledge of DfX principles (DFM, DFA, DFT) and how engineering design decisions impact factory yields and field reliability.
- Ability to lead multi-disciplinary failure analysis (Hardware, Firmware, Reliability, Operations) under compressed launch schedules.
- Excellent clear, concise executive communication skills with the ability to summarize complex technical risks and drive alignment across global teams.
