Technical Program Manager (MCL)

Preferred

• Master of Science degree in related discipline with background in electronic packaging, chip package designs and/or chip cooling solution.

• Prior experience in electronic packaging industry and/or chip design industry

• Established relationships within OSATs, ODMs and/or chip vendors

Skills & Attributes

• Highly analytical and strategic thinker with quality and reliability of product in mind

• Skilled in DFx (x = manufacturability, reliability, and/or test)

• Comfortable in operating with ambiguity in fast‑evolving technology markets

• Excellent communication skills in English; Mandarin proficiency strongly preferred