Technological Sourcing Manager - Packaging (2.5D/3.5D/Panel)

1.Responsible for technology and supply ecosystem planning in Data Center ASIC Packaging (2.5D/3.5D/Panel) domains.
2.Develop deep understanding of suppliers' technology capabilities, capacity planning, and roadmap direction to build strategic ecosystem insights.
3.Engage with R&D early during product definition and design phases to incorporate supply chain and manufacturing perspectives.
4.Ensure product design are aligned with future supplier technology readiness, capacity, and manufacturing capability during design phases.
5.Proactively identify technology and supply risks to enable scalable and competitive product solutions during design phases.

#LI-JK1

1.Strong understanding of advanced packaging, 2.5D/3.5D/Panel, and semiconductor manufacturing ecosystems; Deep understanding of semiconductor supply ecosystems, including foundries, OSATs, memory suppliers, substrate vendors, and strategic partners.
2.Demonstrated expertise in the technology domains is preferred: 2.5D/3.5D/Panel
3.Strong capability to achieve alignment and resolve complex technical challenges across organizations.
4.Strong capability in technology planning, supply readiness assessment, and risk management.