Technology & Market Analyst - Semiconductor Packaging

Yole Group is an international company recognized for its expertise in analyzing markets, technological developments, and supply chains, as well as the strategy of key players in the semiconductor, photonic, and electronic sectors. Yole Group’s business activities include daily interactions with a network of major operators in these industries which has been built on mutual trust over many years.

JOB DESCRIPTION & MAIN TASKS

Yole Group is opening a Technology & Market Analyst position specialized in semiconductors packaging to develop our activities and perform technology, market, business and strategic analysis.

As part of our expert team, you will play a central role in delivering in-depth insights and strategic analysis focused on different packaging technologies such as legacy package and advanced packaging (Fan-Out, Fan-In (WLCSP), Flip-Chip (BGA and CSP), 2.5D & 3D, SiP, PLP, CPO) and their usages and applications all along the supply chain.

You will also collaborate with analysts across various other domains to contribute to cross-functional projects as needed.

Location: Taipei, Taiwan.
Travel: 3–4 times per year for international conferences, trade shows, and customer meetings.

As a Technology & Market Analyst, your main tasks will be to:

• Oversee technology and industry insights from legacy package to advanced packaging market trends from devices to package type.
  
• Collect data from different sources according to our internal methodologies
  
• Understand the impact of the emergence of new or improved technologies in various applications
  
• Execute business, marketing, technology analysis within a given timeframe and budget
  
• Create and manage long-term relationships with customers and answer clients' inquiries
  
• Collect information and promote our activities in conferences and dedicated tradeshows
  
• Give presentations at international conferences and workshops
  

Requirements

PROFILE

• University Degree (Masters, Engineer, PhD) in a semiconductor related field (micro-electronics, physics, nanotechnologies) is mandatory.
  
• An MBA or a double degree in Business would be a real plus.
  
• A proven experience of + 3 years in the advanced packaging field is mandatory
  
• Strong awareness of the advanced packaging technologies & advanced substrate
  
• In-depth knowledge of the microelectronics industry: supply chain, business models, market strategies, and opportunities
  
• Good knowledge of data modelling
  
• Required English level: minimum CECR - C1 or IELTS >6.5 or equivalent