瑞軒科技股份有限公司 Posted Oct 20, 2026 Updated Oct 27, 2026 4 views W_韌體研發工程師(Android BSP) Apply Tailor my CV Posted Oct 20, 2026 Updated Oct 27, 2026 4 views Discussion Report Save to board 瑞軒科技股份有限公司 · W_韌體研發工程師(Android BSP) Apply Tailor my CV Description Company Discussion Report Save to board Description 1. Android BSP, Linux driver Development.2. System Bootloader Development.3. Android HAL, Framework Development and Integration.4. Hardware Board Bring up and Performance Tuning.5. Troubleshooting and debugging. Skills Android ? Linux ? Tailor my CV Apply
Connect over MCP — free, no account needed to search.