Wafer Backend Process Engineer — Bumping, Wet Clean, Yield
Summary
Process Engineer optimizing semiconductor wafer bumping, singulation, grinding, and mounting to improve yield and quality in backend packaging operations.
Private Advertiser is seeking a hands-on Process Engineer to support backend semiconductor packaging operations with a focus on wafer bumping, singulation, grinding, and mounting. You will analyze data, drive improvements, and collaborate with cross-functional teams to meet output, quality, and safety targets.
The ideal candidate has a mechanical or materials engineering background, 2+ years in semiconductor processes, and strong analytical and communication skills.